| 摘要 |
PROBLEM TO BE SOLVED: To provide a phenolic resin molding compound capable of giving a molded product high in mechanical strength at high temperatures and slight in burr development. SOLUTION: The phenolic resin molding compound comprises a phenolic resin with a weight-average molecular weight of≥50,000 on a polystyrene basis, glass fiber, polyhydric alcohol(s) and a filler. In this molding compound, it is preferable that≥50 wt.% of the filler be 30-50μm in particle size and≥80 wt.% thereof be 1-100μm in particle size, and the polyhydric alcohol(s) include ethylene glycol and/or diethylene glycol and the content thereof being 1-3 wt.% based on the whole molding compound. COPYRIGHT: (C)2006,JPO&NCIPI
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