发明名称 |
MEMORY CARD STRUCTURE AND MANUFACTURING METHOD THEREOF |
摘要 |
A memory card structure comprising a substrate, a plurality of memory chips, some package material and an ultra-thin plastic shell is provided. To fabricate the memory card, a substrate having a first surface and a second surface is provided. The first surface has a plurality of outer contacts and the second surface has at least a cavity. There is a plurality of inner contacts around the cavity. Furthermore, the outer contacts and the inner contacts are electrically connected to each other. The memory chips are stacked up inside the cavity and electrically connected to the inner contacts of the substrate. Then, the memory chips and the inner contacts are encapsulated using the molding compound. Thereafter, the ultra-thin plastic shell is placed over the second surface and attached to the substrate. That portion of the ultra-thin plastic shell covering the memory chips has a thickness of about 0.1~0.15 mm. |
申请公布号 |
KR20050099453(A) |
申请公布日期 |
2005.10.13 |
申请号 |
KR20040108990 |
申请日期 |
2004.12.20 |
申请人 |
ADVANCED FLASH MEMORY CARD TECHNOLOGY CO., LTD. |
发明人 |
KUO CHENG HSIEN;JIANG MING JHY;YU CHENG KANG;CHUANG HUI CHUAN |
分类号 |
G06K19/077;G06K19/07;G11C5/00;G11C5/04;H01L21/98;H01L23/538;H01L25/065;H01R24/00 |
主分类号 |
G06K19/077 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|