| 摘要 |
PROBLEM TO BE SOLVED: To provide a procedure for measuring and evaluating adhesiveness of a thin film having the film thickness of 10μm or less, especially a photosensitive resin film, which is used in an electronic device. SOLUTION: When cutting and exfoliating the thin film by a cutting blade, in order to reduce strengthening of a horizontal force generated after exfoliation, water drops are dropped onto the contact surface between the cutting blade and the thin film, to thereby reduce a frictional force on the contact surface. Hereby, the horizontal force can be measured and evaluated stably and accurately. COPYRIGHT: (C)2006,JPO&NCIPI
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