发明名称 SURFACE TREATMENT METHOD AND SURFACE TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a surface treatment method and a surface treatment device capable of forming a coating layer having the performance to be required while suppressing influence on the member to be treated caused by heat input. SOLUTION: In the surface treatment method and device therefor, voltage is applied to the space between the electrically conductive member 11 to be treated and a bar-shaped electrode 3 to generate discharge, thus a coating layer 18 of electrode components is formed on the surface of the member 11 to be treated. The coating layer 18 is formed while vibrating the electrode 3 between a state where the tip part of the electrode 3 is contacted with the member 11 to be treated and a state where the electrode 3 and the member to be treated are separated by a distance at which discharge is generated therebetween or further. Thus, the coating layer satisfying the performance to be required can be formed, and further, heat input volume at the time of forming the coating layer can be securely reduced to≤1 kJ/cm. Thus, the coating layer having the performance to be required can be formed while suppressing influence on the member to be treated caused by heat input. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005281802(A) 申请公布日期 2005.10.13
申请号 JP20040099562 申请日期 2004.03.30
申请人 HITACHI LTD 发明人 NISHIOKA EIJI;WATANABE ATSUSHI;ANZAI HIDEYA
分类号 C23C26/00;(IPC1-7):C23C26/00 主分类号 C23C26/00
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