发明名称 FILM DEPOSITION METHOD BY HEATING BODY CVD DEVICE AND HEATING BODY CVD METHOD
摘要 PROBLEM TO BE SOLVED: To provide a film deposition method by a heating body CVD device and a heating body CVD method capable of realizing substantially uniform thickness of a film deposited on a base body. SOLUTION: The heating body CVD device comprises a vacuum container 1 to store a base body 2, a gas feed means 7 to feed raw gas into the vacuum container 1, and a long-sized heating body 4 disposed to be brought into contact with the raw gas fed from the gas feed means 7, and performs film deposition by decomposing the raw gas from the gas feed means 7 by the heat generated by the heating body 4, and depositing the decomposed raw gas component on the base body 2. The end of the heating body 4 is made movable in a longitudinal direction of the heating body 4 during heating of the heating body 4. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005281776(A) 申请公布日期 2005.10.13
申请号 JP20040097724 申请日期 2004.03.30
申请人 KYOCERA CORP 发明人 IKEDA AKIHIKO;OKUBO DAIGORO
分类号 C23C16/44;(IPC1-7):C23C16/44 主分类号 C23C16/44
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