发明名称 Method of manufacturing display device and substrate bonding apparatus
摘要 To provide a display device manufacturing method capable of rapidly and reliably bonding a plurality of display elements arranged in plan view to a substrate to manufacture a high-quality display device with high yield. A display device manufacturing method of the present invention comprises a step of applying an adhesive forming an adhesive layer on at least one of bonding surfaces of a display panel and a substrate, a step of bring the edge of one side of a bonding surface of the display panel into contact with a bonding surface of the substrate so that the display panel and the substrate are arranged opposite to each other substantially in a wedge shape in side view, and a step of making the substrate approach the display panel while maintaining the arrangement of the wedge shape and of bonding the substrate to the display panel while spreading the adhesive by the bonding surfaces.
申请公布号 US2005224156(A1) 申请公布日期 2005.10.13
申请号 US20050092733 申请日期 2005.03.30
申请人 SEIKO EPSON CORPORATION 发明人 MIYAZAWA HIDEAKI
分类号 H05B33/04;B32B37/00;B32B37/12;G02F1/13;G09F9/00;G09F9/30;G09F9/40;H01L27/32;H01L51/50;H05B33/02;H05B33/10;H05B33/14;(IPC1-7):B32B31/16;B32B31/00 主分类号 H05B33/04
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