发明名称 |
Semiconductor device package having buffered memory module and method thereof |
摘要 |
A method and apparatus of fabricating a semiconductor device are disclosed. The semiconductor device may include a buffer chip package having a buffer chip mounted on a buffer chip substrate and at least one memory package mounted on the buffer chip substrate, wherein the at least one memory package may include a plurality of memory chips. Further, the buffer chip package may have a plurality of external connection terminals.
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申请公布号 |
US2005224948(A1) |
申请公布日期 |
2005.10.13 |
申请号 |
US20050033845 |
申请日期 |
2005.01.13 |
申请人 |
LEE JONG-JOO;SONG YOUNG-HEE |
发明人 |
LEE JONG-JOO;SONG YOUNG-HEE |
分类号 |
H01L23/50;G11C11/00;H01L23/02;H05K1/18;(IPC1-7):H01L23/02 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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