Method and device for conditioning semiconductor wafers and/or hybrids

摘要

The present invention provides a method for conditioning semiconductor wafers and/or hybrids having the steps: preparation of a space ( 1 ) which is at least partially enclosed and has a wafer/hybrid holding device ( 10 ) which is located therein and has the purpose of holding a semiconductor wafer and/or hybrid; and conduction of a dry fluid through the wafer/hybrid holding device ( 10 ) in order to heat-treat the wafer/hybrid holding device ( 10 ); wherein at least a portion of the fluid leaving the wafer/hybrid holding device ( 10 ) is used to condition the atmosphere within the space ( 1 ). The invention also provides a corresponding device for conditioning semiconductor wafers and/or hybrids.