发明名称 |
Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus |
摘要 |
A multilayer circuit board including a laminate of at least one insulating layer and at least one wiring layer. The wiring layer is formed by a composite member having a first metal layer and a second metal layer formed on one or both sides of the first metal layer. The first metal layer having a smaller coefficient of thermal expansion than the second metal layer. The second metal layer having a higher electric conductivity than the first metal layer. The insulating layer has a blind via-hole with a bottom provided by a surface of the second metal layer. A layer-to-layer interconnection portion is provided on the surface of the insulating layer and in the blind via-hole and is formed in the blind via-hole to be in contact with the surface of the second metal layer.
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申请公布号 |
US2005225956(A1) |
申请公布日期 |
2005.10.13 |
申请号 |
US20050142398 |
申请日期 |
2005.06.02 |
申请人 |
SUWA TOKIHITO;AKAHOSHI HARUO;KUMAMOTO SHINGO |
发明人 |
SUWA TOKIHITO;AKAHOSHI HARUO;KUMAMOTO SHINGO |
分类号 |
H05K1/09;H01L21/4763;H01L23/12;H01L23/14;H05K1/11;H05K1/14;H05K3/44;H05K3/46;(IPC1-7):H01L21/476 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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