发明名称 |
Power semiconductor device package |
摘要 |
A power semiconductor device package according to one aspect of the present invention comprises: a plurality of power semiconductor chips which are arranged in a laminated structure so that the plurality of power semiconductor chips are opposing to each other at the surfaces with the same electrical structures, and which are connected in parallel to one another, and are sealed in a sealing resin as one body. |
申请公布号 |
US2005224945(A1) |
申请公布日期 |
2005.10.13 |
申请号 |
US20040867758 |
申请日期 |
2004.06.16 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
SAITO WATARU;OMURA ICHIRO |
分类号 |
H01L25/07;H01L23/02;H01L23/495;H01L25/18;(IPC1-7):H01L23/02 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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