| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection device capable of exactly measuring the height of connection terminals of semiconductor components without being affected by scratch and foreign articles existing at locations other than the connection terminals. SOLUTION: The inspection device 100 for semiconductor components comprises a holder 20 for holding the semiconductor component 1, a pressure sensor sheet 10 indicating variation according to the pressure when received, and a pressurizer 30 for grasping the holder 20 and pressing and contacting a plurality of solder bumps 2 of the semiconductor component 1 to the pressure sensor sheet 10. The pressure sensor sheet 10 senses the pressure from each solder bump 2 and sends the signal to the signal processor 40. The signal processor 40 calculates the pressure value and sends the data to a controller 50 and the controller 50 judges good or bad of the semiconductor components 1. COPYRIGHT: (C)2006,JPO&NCIPI
|
