| 摘要 |
PROBLEM TO BE SOLVED: To correctly detect the thickness of a deposited material layer at the film deposition. SOLUTION: An aperture is formed in a predetermined part of a film deposition chamber 10 for performing the vacuum vapor deposition, the light transmitted through a substrate 14 and a film deposited on the substrate 14 is irradiated from a light emitter 26, and the transmitted light is detected by a light receiver 28. The light emitter and the light receiver may be provided in the film deposition chamber. During the vapor deposition, the absorption intensity (or the fluorescence intensity or the reflection intensity may be acceptable) at a film thickness monitoring unit 52 formed of the same material at a part of the substrate 14 is detected based on the data from a light receiving unit 28. A material layer of the target thickness is deposited on the substrate by adjusting the deposition speed by controlling the moving speed of a crucible 18, the heating state of a heater 20 or the like by a control device 30. COPYRIGHT: (C)2006,JPO&NCIPI
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