| 摘要 |
PROBLEM TO BE SOLVED: To easily form wiring patterns by reducing number of processes. SOLUTION: An ozone solution is brought into contact with a substrate 6 arranged with a filler member 4 in a prescribed pattern in a resin and the resin portion is selectively activated and is etched to expose the surface of the filler member 4; thereafter, an electroless plating film 7 is formed on a portion exclusive of the surface of the filler member exposed by the electroless plating treatment. Since the electroless plating film 7 having excellent adhesion is formed in the resin portion excluding the surface of the exposed filler member 4, the filler member 4 is previously arranged in the prescribed pattern, and thereby the prescribed wiring pattern can be formed without using a photoresist. COPYRIGHT: (C)2006,JPO&NCIPI
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