Double side probing of semiconductor devices

摘要

A probe head for testing the properties of a semiconducting device ( 10 ) under test including a dielectric film ( 24 ) supporting at least one semiconducting device ( 10 ) under test with a support frame ( 26 ) tautly supporting the dielectric film ( 24 ). A first support ( 40 ) positions a first probe ( 28 ) for electrically contacting a first side ( 16 ) of the semiconducting device ( 10 ) under test and a second support ( 34 ), having a actuator to move a second probe ( 30 ) between a first position (P 1 ) and a second position (P 2 ), positions second probe ( 30 ) with the second position (P 2 ) being for electrically contacting an opposing second side ( 18 ) of the semiconductor device under test.