| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical semiconductor package structured to be able to provide satisfactory receiving sensitivity without causing a decrease in optical transmittance even if a blue semiconductor laser in an infrared ray region is irradiated. <P>SOLUTION: The optical semiconductor package comprises an optical semiconductor chip 12 having at least one of a light emitting unit and a light receiving unit, a base board 15 formed with a plurality of through hole electrodes 20 on the side thereof and provided with a window hole 19 for containing the optical semiconductor chip 12 therein, and a transparent circuit board 14 on which the semiconductor chip 12 is mounted. An electrode pattern 16 is formed, wherein the circuit board 14, on which the optical semiconductor chip 12 is flip flop-mounted, is integrally bonded to the base board 15 with the surface of the circuit board 14 down. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
