发明名称 RESIN MOLDING TYPE SECONDARY BATTERY AND ITS FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a resin molding type secondary battery filling a gap between a bare cell and a protection circuit substrate with resin molding and to provide a resin molding method of the resin molding type secondary battery in a secondary battery forming method. SOLUTION: The forming method of the resin molding type secondary battery has a step installing supporting pins 310, 320 in a mold 100 so that the side comes in contact with the back surface of the protection circuit substrate 30 in the prescribed position, a step moving a protection site so that the front step surface of the protection site comes in contact with a terminal surface, and a step pouring resin in the mold 100, and pin holes coming in contact with one side facing a bare cell 10 of the protection circuit substrate 30 in parallel to the protection circuit substrate 30 over a prescribed section are formed in a part made of forming resin. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005285759(A) 申请公布日期 2005.10.13
申请号 JP20050064391 申请日期 2005.03.08
申请人 SAMSUNG SDI CO LTD 发明人 YOON HEUI SANG
分类号 H01M2/10;H01M2/02;H01M10/04;H01M10/34;H01M10/42;(IPC1-7):H01M2/10 主分类号 H01M2/10
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