| 摘要 |
PROBLEM TO BE SOLVED: To provide a compact piezoelectric vibrator in which a piezoelectric elemental plate is supported by means of bumps and an electrically conductive adhesive on an electrically conductive pad in a cantilevered state to be hermetically sealed thereon, and to provide its fabricating method. SOLUTION: There is provided a fabricating method of a structure in which the piezoelectric elemental plate is supported through a connection electrode on the electrically conductive pad upon an insulation substrate inside a piezoelectric vibrator container in the cantilevered state to be hermetically sealed thereon, and is provided its piezoelectric vibrator. The fabricating method includes a process where the bumps are formed on the electrically conductive pad, that where the piezoelectric elemental plate is arranged and the bumps are connected by welding to the piezoelectric elemental plate by means of supersonic vibration and that where the electrically conductive pad and an external terminal of the piezoelectric elemental plate are adhered together by the electrically conductive adhesive. A vibrating electrode formed on front and back sides of the piezoelectric elemental plate is allowed to conduct to the external terminal through the connection electrode by means of the electrically conductive adhesive applied so as to range from the bumps formed on the electrically conductive pad and the electrically conductive pad to the piezoelectric elemental plate. COPYRIGHT: (C)2006,JPO&NCIPI
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