| 发明名称 |
Cleaning method and solution for cleaning a wafer in a single wafer process |
| 摘要 |
The present invention is a novel cleaning method and a solution for use in a single wafer cleaning process. According to the present invention the cleaning solution comprises ammonium hydroxide (NH<SUB>4</SUB>OH), hydrogen peroxide (H<SUB>2</SUB>O<SUB>2</SUB>), water (H<SUB>2</SUB>O) and a chelating agent. In an embodiment of the present invention the cleaning solution also contains a surfactant. And still yet another embodiment of the present invention the cleaning solution also comprises a dissolved gas such as H<SUB>2</SUB>. In a particular embodiment of the present invention, this solution is used by spraying or dispensing it on a spinning wafer.
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| 申请公布号 |
US2005227888(A1) |
申请公布日期 |
2005.10.13 |
| 申请号 |
US20050145304 |
申请日期 |
2005.06.03 |
| 申请人 |
VERHAVERBEKE STEVEN;TRUMAN J K |
发明人 |
VERHAVERBEKE STEVEN;TRUMAN J. K. |
| 分类号 |
C11D1/29;C11D1/72;C11D3/02;C11D3/04;C11D3/30;C11D3/32;C11D3/33;C11D3/39;C11D7/06;C11D7/18;C11D7/26;C11D7/32;C11D11/00;H01L21/00;H01L21/304;H01L21/306;(IPC1-7):B08B3/12;C11D1/00 |
主分类号 |
C11D1/29 |
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