摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which defines an area for making a test probeto abut on an electrode pad, bonds an external electrode away from an area where a probe mark of the electrode pad is left, elevates the reliability of bonding, and enables high integration by expanding a location area of wiring on a circuit under the electrode pad, and to provide its inspection method and its manufacturing method. <P>SOLUTION: The semiconductor device includes probe area marks 41a-41d each showing an area to contact the test probe to the electrode pad 4, limits the abutting area of the test probe in the electrode pad with a prob area mark, and elevates the reliability of bonding. On a layer immediately below the electrode pad 4, a wiring layer 123 is not formed in an area immediately below a test probe area TPA, and the wiring layer 123 is formed in an area except the test probe area TPA. An area where the circuit wiring immediately below the electrode pad can be formed is expanded to allow the high integration of wiring. <P>COPYRIGHT: (C)2006,JPO&NCIPI |