SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR MODULE UNIT

摘要

PROBLEM TO BE SOLVED: To provide a COF (chip on film) type semiconductor device which has a good accuracy of connection positions between the connection terminal of a semiconductor element and the connecting terminal of a wiring pattern in a wiring circuit board and has a small outer dimensional size.

SOLUTION: The semiconductor device comprises a wiring circuit board 16 having a plurality of wiring patterns 2 provided on a tape carrier 10, and a semiconductor element 12 mounted on the wiring board 16 via an insulating resin 11 disposed therebetween. A plurality of projected electrodes 13 provided to the semiconductor element 12 and connecting terminals 2a of the wiring patterns 2 are electrically connected each other. In the semiconductor device, alignment marks 1 for positioning between the projected electrodes 13 and the connecting terminals 2a are provided on a semiconductor element mounting region of the insulating resin 11 on the tape carrier 10. The alignment mark is coated on its entire upper surface with the insulating resin 11.

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