发明名称 INTEGRATED CIRCUIT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an integrated circuit device which includes a temperature sensor which can stably measure temperature with higher accuracy in the integrated circuit device provided with a resistance body as the temperature sensor which changes electrical resistance value in accordance with temperature. SOLUTION: The temperature monitoring member 6 formed of vanadium oxide is provided within the semiconductor integrated circuit device 1 wherein one end thereof is connected to a via V3 and the other end is connected to a via V4. At the lower side of the temperature monitoring member 6, an equally heating member 5 formed of aluminum is also provided. In the viewing from the flat plane, a half or more larger region of the entire part of the temperature monitoring member 6 is overlapped with the equally heating member 5. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005286238(A) 申请公布日期 2005.10.13
申请号 JP20040101098 申请日期 2004.03.30
申请人 NEC ELECTRONICS CORP;NEC CORP 发明人 OKUBO HIROAKI;NAKASHIBA YASUTAKA;KAWAHARA HISAYOSHI;MURASE HIROSHI;ODA NAOKI;SASAKI NARIHITO;ITO NOBUKAZU
分类号 H01L23/52;G01K7/16;H01L21/3205;H01L21/822;H01L23/34;H01L23/522;H01L23/58;H01L27/00;H01L27/04;H01L31/058;(IPC1-7):H01L21/822;H01L21/320 主分类号 H01L23/52
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