发明名称 |
INTEGRATED CIRCUIT DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide an integrated circuit device which includes a temperature sensor which can stably measure temperature with higher accuracy in the integrated circuit device provided with a resistance body as the temperature sensor which changes electrical resistance value in accordance with temperature. SOLUTION: The temperature monitoring member 6 formed of vanadium oxide is provided within the semiconductor integrated circuit device 1 wherein one end thereof is connected to a via V3 and the other end is connected to a via V4. At the lower side of the temperature monitoring member 6, an equally heating member 5 formed of aluminum is also provided. In the viewing from the flat plane, a half or more larger region of the entire part of the temperature monitoring member 6 is overlapped with the equally heating member 5. COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2005286238(A) |
申请公布日期 |
2005.10.13 |
申请号 |
JP20040101098 |
申请日期 |
2004.03.30 |
申请人 |
NEC ELECTRONICS CORP;NEC CORP |
发明人 |
OKUBO HIROAKI;NAKASHIBA YASUTAKA;KAWAHARA HISAYOSHI;MURASE HIROSHI;ODA NAOKI;SASAKI NARIHITO;ITO NOBUKAZU |
分类号 |
H01L23/52;G01K7/16;H01L21/3205;H01L21/822;H01L23/34;H01L23/522;H01L23/58;H01L27/00;H01L27/04;H01L31/058;(IPC1-7):H01L21/822;H01L21/320 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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