| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper clad laminate for a flexible printed circuit board which minimizes the lowering of adhesive strength by moisture absorption and heat history, secures reliability even after being processed into a printed circuit board, and is especially suitable for the production of various electronic devices including a cellular phone, a digital camera, PDA, and a car navigator. SOLUTION: In the copper clad laminate, an insulating layer of a polyimide resin is formed on a conductor made of copper foil or copper alloy foil. The surface of the conductor in contact with the insulating layer is subjected to rustproofing treatment. The 90°peel strength between the conductor and the insulating layer at room temperature after being subjected to a heating shelf test in which a specimen is allowed to stand in the atmosphere at 150°C for 500 h is at least 80% of that before the test. COPYRIGHT: (C)2006,JPO&NCIPI |
