| 摘要 |
PROBLEM TO BE SOLVED: To alleviate thermal stress within a laminated chip package and thereby to provide a highly reliable laminated chip package. SOLUTION: Since a highly rigid metal piece 106 is provided on a semiconductor chip 108, it is possible to effectively inhibit the deformation of the entire chip laminate. When a lead-free soldering or the like is used to bond a chip lamination type package 100 to a packaging substrate, the package is exposed to a high temperature of about 240°C. However, according to a structure, it is possible to suppress the warpage or the like of each semiconductor chip by deformation suppressing properties of the metal piece 106 even under such conditions, and thereby to effectively inhibit a reduction in adherence between the semiconductor chips, a poor connection at a wire bonding region, or the like. COPYRIGHT: (C)2006,JPO&NCIPI
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