| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition that has improved shelf life in the form of prepreg, in other words, in the tack dry state, and can produce laminated plates for printed wiring board that gives high glass transition point after curing and shows excellent adhesion and heat resistance and provide prepreg and laminated plates using the composition. SOLUTION: This resin composition includes, as resin components, a bisphenol A type epoxy resin, a cresol novolac type epoxy resin and, as a curing component, dicyandiamide and 4,4'-diaminodiphenyl sulfone. Prepreg is prepared by placing the resin composition on a sheet-like fibrous base material and laminate plates are produced by the thermal compression-molding of the prepreg. COPYRIGHT: (C)2006,JPO&NCIPI
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