| 摘要 |
PROBLEM TO BE SOLVED: To provide a removable process film for attaching to a flexible printed wiring board, which, in the process of manufacturing an electrical/electronic apparatus using the flexible printed wiring board, can effectively control solvent contamination, mixing of foreign substances, generation of cracks and the like onto the printed wiring board surface. SOLUTION: In the removable process film for attaching to the flexible printed wiring board which has a base material film and an adhesive agent layer provided on one surface thereof, the above adhesive agent layer is formed by using an adhesive containing an acrylic copolymer having at least a butyl acrylate unit of≥40 mass%, styrene unit, methyl methacrylate unit, methyl acrylate unit, hydroxyl group-containing vinyl monomer unit and carboxyl group-containing vinyl monomer unit, and an ioscyanate crosslinking agent. And the removable process film has specific properties. COPYRIGHT: (C)2006,JPO&NCIPI
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