| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible copper-clad laminate which can be easily handled during manufacturing a copper-clad laminate without thinning a copper foil; and shows high pliability, successful bending properties and a high stress relaxation effect after molding. SOLUTION: In the flexible copper-clad laminate with a copper foil layer formed on one surface or both surfaces of a polyimide resin layer through a heat treatment process, the modulus of elasticity (p2) of the copper foil layer before heat treatment is 50 to 80 GPa and the ratio (p2/p3) of the modulus of elasticity (p2) before heat treatment to the modulus of elasticity (p3) after heat treatment at higher than 300°C is 3.5 to 5.5. COPYRIGHT: (C)2006,JPO&NCIPI
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