MANUFACTURING METHOD FOR ELECTRON EMISSION DEVICE HAVING HIGH PACKING DENSITY

摘要

PROBLEM TO BE SOLVED: To provide a structure of an electron emission device having high packing density of an emitter and to provide its manufacturing process.

SOLUTION: An electron emission property element suitable for a flat panel type display is manufactured by high packing density. An electronic emitter has a base supporting the structure. A lower side non-insulation region patterned into a shape forming a plurality of parallel lines is formed on an insulation material which is the base. An electron emission property filament is formed in a hole extending in an insulation layer provided on the lower side non-insulation region. Typically, a patterned non-insulation gate layer is provided on the insulation layer to form a gate control type device. Preferably, a position of an electron emission mechanism is delimited using a charged particle track. By using the charged particle track, the electron emission mechanism is greatly miniaturized and is arranged by bringing mutual interval close.

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