发明名称 WIRE BONDING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a wire bonding apparatus capable of sensing a ground wire break without necessitating a dedicated ground wire break sensing means, with the apparatus not requring a cost increase. <P>SOLUTION: The wire bonding apparatus has a constant current circuit 10 comprising a high-voltage control circuit 11 and a current detecting circuit 12 for keeping constant the discharge current and a current sensing circuit 10 for a process wherein a high-voltage source 4 is connected to an electric torch 6 via a voltage supply line 7, a wire 1 is connected to the high-voltage source 4 via a ground wire 5, and a high voltage is applied by the high-voltage source 4 across the end of the wire 1 and the electric torch 6 for starting a discharge between them for the formation of a ball on the end of the wire 1. The current sensing circuit 12 of the constant current circuit 10 senses the current in the ground wire 5 and is so connected that the sensed current is input into the high-voltage control circuit 11 of the constant current circuit 10. In the absence of an output from the current sensing circuit 12 during a discharge, it is decided that a break 5a exists in the ground wire 5. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005286080(A) 申请公布日期 2005.10.13
申请号 JP20040097401 申请日期 2004.03.30
申请人 SHINKAWA LTD 发明人 SASAKURA KAZUMASA
分类号 H01L21/60;B23K20/00;H02H3/00 主分类号 H01L21/60
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