| 发明名称 |
ABRASIVES AND COMPOSITIONS FOR CHEMICAL MECHANICAL PLANARIZATION OF TUNGSTEN AND TITANIUM |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a fumed silica useful for polishing tungsten and titanium on a semiconductor wafer. <P>SOLUTION: The method prepares a predetermined volume of water and a predetermined concentration of the fumed silica that is 35 wt % of the volume of water. Then, an acid of a concentration being 0.0010 to 0.5 wt % of the concentration of the fumed silica is mixed into the water of the predetermined amount, and the fumed silica is dispersed into the acidified water. Further, the fumed silica is recovered by being diluted with water having pH of 1 to 7. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
| 申请公布号 |
JP2005286336(A) |
申请公布日期 |
2005.10.13 |
| 申请号 |
JP20050093375 |
申请日期 |
2005.03.29 |
| 申请人 |
ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC |
发明人 |
MUELLER BRIAN L;YU CHARLES |
| 分类号 |
B24B37/00;C01B33/12;C09G1/02;C09K3/14;H01L21/304;H01L21/321;(IPC1-7):H01L21/304 |
主分类号 |
B24B37/00 |
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