发明名称 ELECTRONIC COMPONENT EQUIPPED WITH THERMOSENSITIVE ELEMENT
摘要 PROBLEM TO BE SOLVED: To reduce a detection error generated in a thermosensitive element by an atmospheric temperature. SOLUTION: A lead wire 48 of the thermosensitive element drawn out of an element body part for detecting the temperature is pressed onto a temperature detection object 31 by a pressing means 28, in this electronic component (for example, a DC-DC converter) equipped with the thermosensitive element. The temperature detection object is a heat conducting member to which the heat generated by heat generating elements 21a-21d (for example, an FET) is conducted. The electronic component has a support member 25 for pressing the heat generating elements onto the heat conducting member, and the support member has the pressing means 28 integrally. The pressing means has the approximately flat bottom surface for pressing the lead wire, and forms a bending part on the edge part in contact with the lead wire on the bottom surface. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005283149(A) 申请公布日期 2005.10.13
申请号 JP20040093066 申请日期 2004.03.26
申请人 TDK CORP 发明人 KANEKO KOJI
分类号 G01K1/14;G01K7/22;H01L23/34;(IPC1-7):G01K1/14 主分类号 G01K1/14
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