| 摘要 |
PROBLEM TO BE SOLVED: To provide a means that can solve the problem of the positional deviations between lands and holes caused by the alignment performed, at the forming of an etching resist layer and plating resist layer in a method of manufacturing circuit board, using the subtractive method, additive method, and semi-additive method, etc. SOLUTION: The method of manufacturing circuit board includes a step of forming a first resin layer on the surface of an insulating substrate, having a conductive layer on its surface and on the internal walls of a through hole or/and a non-through hole, a step of forming a second resin layer which is insoluble or hardly soluble in a first resin layer developing solution on the first resin layer formed on the surface conductive layer, and a step of removing the first resin layer formed on the holes by means of the first resin layer developing solution. The method also includes a step of inducing a potential difference, between the first resin layer formed on the holes and the first resin layer formed on the surface conductive layer, by uniformly making the surface of the first resin layer charged, before the second resin layer is formed. COPYRIGHT: (C)2006,JPO&NCIPI |
