Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby

摘要

To encapsulate electronic modules in a manner which is substantially resistant to water diffusion yet is carried out at moderate temperatures below 300° C., preferably below 150° C., the invention provides a process for forming a housing for electronic modules, in particular sensors, integrated circuits and optoelectronic components; comprising the steps of: providing a substrate ( 1 ), of which at least a first substrate side ( 1 a) is to be encapsulated, providing a vapor-deposition glass source ( 20 ), arranging the first substrate side ( 1 a) in such a manner with respect to the vapor-deposition glass source that the first substrate side ( 1 a) can be vapor-coated; vapor-coating the first substrate side with a glass layer ( 4 ).