CIRCUIT BOARD ASSEMBLY AND METHOD OF ATTACHING A CHIP TO A CIRCUIT BOARD
摘要
An antenna array (100) is assembled by direct attaching a flip chip transmit/receive (T/R) module (1) to an antenna circuit board (2). A fillet bond (6) is applied to the circuit board (2) and the flip chip T/R module (1) around at least a portion of the periphery of the flip chip T/R module (1).
申请公布号
WO2005069430(A3)
申请公布日期
2005.10.13
申请号
WO2005US01800
申请日期
2005.01.13
申请人
RAYTHEON COMPANY
发明人
HAUHE, MARK, S.;ROLSTON, KEVIN, C.;QUAN, CLIFTON;FENGER, HAROLD, S.;WONG, TSE, E.