SURFACE ACOUSTIC WAVE DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To solve the problem that the corrosion of IDT or the like is caused to degrade a performance as a SAW device remarkably due to moisture infiltrating into airtight space under environment of high moisture. SOLUTION: The surface acoustic wave device is provided with a surface acoustic wave chip, a mount board which flip-chip-mounts the surface acoustic wave chip on an upper face and sealing resin covering an outer face of the surface acoustic wave chip and an upper face of the mount board while airtight space is formed between IDT formed in the surface acoustic wave chip and the mount board. A frame overlapped with a peripheral edge part of the surface acoustic wave chip is formed on the upper face of the mount board. The frame has thickness thinner than a gap between the surface acoustic wave chip and the mount board and a face which is brought into contact with sealing resin of the frame is formed of a material which is mainly composed of a metallic element where a change of oxide formation standard free energy is a negative big value. COPYRIGHT: (C)2006,JPO&NCIPI