发明名称 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, COMPUTER PROGRAM, AND MEMORY
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method capable of restricting the lowering of throughput by making a replacing operation of a substrate into a module even when the delivery of a substrate has been delayed. SOLUTION: In a substrate processing apparatus, when the substrates are allocated in a certain sequence from the previous module of the multi-modules by delivery means for each module of multi-modules composed of a plurality of modules which are transferred in identical order and carry out identical processing for substrates, and then when the delivery of an n-th substrate is delayed by m cycles in the previous module, the apparatus changes a transfer schedule so as to move each of n-th and subsequent substrates (including the n-th substrate) in the transfer schedule to a module to which an m-th substrate following the substrate has been allocated. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005286304(A) 申请公布日期 2005.10.13
申请号 JP20040381537 申请日期 2004.12.28
申请人 TOKYO ELECTRON LTD 发明人 AZUMA MAKIO;MIYATA AKIRA
分类号 H01L21/677;H01L21/02;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/677
代理机构 代理人
主权项
地址