发明名称 |
Electrically conductive wire |
摘要 |
A method of soldering comprises disposing first and second balls of solder adjacent one another on a wire; disposing flux on the wire between and in contact with both of the first and second balls and so as to substantially fill a space between the first and second balls; disposing the wire on a substrate so that the first and second balls of solder contact a single conductor on the substrate; and melting the first and second balls of solder and flux and soldering the wire to the conductor.
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申请公布号 |
US2005224932(A1) |
申请公布日期 |
2005.10.13 |
申请号 |
US20050134693 |
申请日期 |
2005.05.20 |
申请人 |
VANHOUTTE EDDY W;DE CLERCQ GILBERT |
发明人 |
VANHOUTTE EDDY W.;DE CLERCQ GILBERT |
分类号 |
H01R11/01;B23K1/20;B23K31/02;B23K35/14;H01L23/02;H01L23/48;H01R4/00;H01R4/02;H01R12/04;H01R12/32;H01R43/02;H05K1/11;H05K1/18;H05K3/34;H05K3/40;(IPC1-7):H01L23/48 |
主分类号 |
H01R11/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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