发明名称 |
CHIP PACKAGE STRUCTURE AND CHIP PACKAGING PROCESS |
摘要 |
A chip packaging process is provided. First, a cavity is formed on a heat sink. A first encapsulant is formed on the bottom of the cavity. A circuit substrate is disposed over the heat sink. The circuit substrate has an opening that corresponds in position to the cavity. Thereafter, a chip is disposed on the first encapsulant and the chip is electrically connected to the circuit substrate. Finally, a compound is deposited over the first encapsulant and the chip to form a chip package. The chip package is warp resistant and the chip packaging process increases overall production yield.
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申请公布号 |
US2005224956(A1) |
申请公布日期 |
2005.10.13 |
申请号 |
US20050907340 |
申请日期 |
2005.03.30 |
申请人 |
KAO CHIN-LI;LAI YI-SHAO;WU JENG-DA;WANG TONG-HONG |
发明人 |
KAO CHIN-LI;LAI YI-SHAO;WU JENG-DA;WANG TONG-HONG |
分类号 |
H01L23/10;H01L23/13;H01L23/28;H01L23/31;H01L23/36;(IPC1-7):H01L23/10 |
主分类号 |
H01L23/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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