发明名称 RESIN SEALING METHOD FOR VIBRATING COMPONENT
摘要 <p>The subject of the invention is to provide a method for sealing a vibrating component with a resin which is suitable for mass production and is capable of covering the vibrating component with a furthermore thin sealing resin without omission. The sealing resin (3) with thixotropic properties, heat setting properties and insulating properties is filled into a resin flowing space (4) through a through-hole (2) by sliding a squeegee (5) along a metal mask plate (1), and the sealing resin (3) stuck on the periphery of a sliding component (120) is heat-cured. The sealing resin (3) with the thixotropic properties has low viscosity during flowing, and is filled into a narrow space (4) into which the resin flows, and in addition, as the viscosity is increased until it is heat-cured and a shape sticking the periphery of the vibrating component (120) is held, the vibrating component (120) can be covered without omission even when it is thin.</p>
申请公布号 KR20050098756(A) 申请公布日期 2005.10.12
申请号 KR20040080518 申请日期 2004.10.08
申请人 SMK CORPORATION 发明人 NAKAYAMA NAOMI;IMAI KAZUO;SAITO ISAMU;YAMAGUCHI YOSHIAKI
分类号 B29C39/10;B29L31/00;G06F3/03;G06F3/033;H01L21/56;(IPC1-7):G06F3/033 主分类号 B29C39/10
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