METHOD FOR PRODUCTION OF A HOLE

摘要

The hole producing process is for use on materials consisting of a high-conductivity substrate such as metal and a low-conductivity coating such as ceramic. It the first stage of the process, material is removed from the hole region (25) in the low-conductivity layer of the material (7) by means of an indenter (13) or a laser (16), so that the hole (10) can subsequently be created by a spark machining process