| 摘要 |
<p>The present invention provides a heat-curable resin composition which is curable and is capable of providing a cured product with low shrinkage in curing. The heat-curable resin composition of the present invention includes an alicyclic epoxy compound (a) having a structure represented by the following general formula (1), <CHEM> ÄIn the general formula (1): R<1> to R<10> each represent hydrogen, or a saturated or unsaturated hydrocarbon group having 1 to 20 carbon atoms, and an ether bond, an ester bond, or an alcoholic hydroxyl group may be included in the hydrocarbon group; R<1> to R<10> may each represent a residue derived by removing any one of R<1> to R<10> from the structure represented by the general formula (1), or a residue derived by removing hydrogen from any one of R<1> to R<10>; and the phrase "in the hydrocarbon group" refers to "inside the hydrocarbon group", "at terminals of the hydrocarbon group", or "within bonds of the hydrocarbon group"Ü, a cationic polymerization initiator (i), a surfactant (e), and optionally a polyol (b) having two or more hydroxyl groups on terminals.</p> |
