Werkwijze en inrichting voor het aan een vormholte toevoeren van omhulmateriaal.

摘要

The present invention relates to a method for feeding encapsulating material to a mould cavity for the purpose of encapsulating electronic components. The invention also relates to a device for feeding encapsulating material to a mould cavity for the purpose of encapsulating electronic components, and to a mould for encapsulating electronic components which can be applied in combination with such a feed device.