发明名称 |
Semiconductor device with improved bonding pad connection and placement |
摘要 |
A semiconductor apparatus includes a substrate with a peripheral edge. A plurality of devices are situated on the substrate and adjacent the peripheral edge, with each device including a first end adjacent the peripheral edge and a second end opposite the first end. A connector port is located between the first end and the second end on each device. A bonding pad is situated atop a portion of each device and coupled to each device by a connector connected to the connector port. Each connector has a connection path of approximately equal length.
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申请公布号 |
US6953997(B1) |
申请公布日期 |
2005.10.11 |
申请号 |
US20040861805 |
申请日期 |
2004.06.04 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
MERIGOT VINCENT;TSAI MING HSIEN |
分类号 |
H01L23/48;H01L23/485;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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