发明名称 |
Semiconductor package |
摘要 |
A semiconductor package is disclosed that bonds a semiconductor chip to a leadframe using a flip chip technology. An exemplary semiconductor package includes a semiconductor chip having a plurality of input-output pads at an active surface thereof. A plurality of leads are superimposed by the bond pads and active surface of the semiconductor chip. The leads have at least one exposed surface at a bottom surface of the package body. A plurality of conductive connecting means electrically connect the input-output pads of the chip to the leads. A package body is formed over the semiconductor chip and the conductive connecting means. The bottom surface portions of the leads are exposed to the outside.
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申请公布号 |
US6953988(B2) |
申请公布日期 |
2005.10.11 |
申请号 |
US20040944241 |
申请日期 |
2004.09.17 |
申请人 |
AMKOR TECHNOLOGY, INC. |
发明人 |
SEO SEONG MIN;CHUNG YOUNG SUK;PAEK JONG SIK;KU JAE HUN;YEE JAE HAK |
分类号 |
H01L23/48;H01L21/60;H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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