| 发明名称 |
Capsulated abrasive composition and polishing pad using the same |
| 摘要 |
Capsulated abrasive compositions and a polishing pad using the same. More specifically, a polishing pad coated with compositions, which contain a capsulated abrasive, thereby used for planarizing interlayer insulating film formed on a semiconductor substrate by chemical mechanical polishing. |
| 申请公布号 |
US6953489(B2) |
申请公布日期 |
2005.10.11 |
| 申请号 |
US20020331252 |
申请日期 |
2002.12.30 |
| 申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
CHOI YONG SOO;PARK HYUNG SOON |
| 分类号 |
B24B37/00;B24B37/04;B24B37/20;B24B37/22;B24B37/24;B24D3/00;B24D3/28;B24D18/00;C09K3/14;H01L21/304;(IPC1-7):B24D11/00 |
主分类号 |
B24B37/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
