| 摘要 |
In view of the miniaturization of semiconductor components, the prevention of particles and other defects on the wafer surface during production is of great importance. The inspection should proceed as process-oriented as possible. For this purpose, devices are needed which on the one hand, are of very compact construction, while on the other hand, they still are equipped with measuring systems meeting the highest requirements. The device according to the invention for measuring surface defects, comprising a sample holder, a rotation drive for the sample holder, wherein the rotational axis runs perpendicular to the sample surface to be measured, an optical measuring system ( 10 ) for measuring scattered light, as well as at least one linear drive ( 23 ) for the measuring system, wherein the rotational direction is radial to the rotational axis of the sample holder, is capable of scanning the entire sample surface ( 16 ). By moving not only the sample, but also the measuring system, the need for space as a whole is reduced and the total device can be constructed with a more compact design.
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