发明名称 |
Technique for monitoring the state of metal lines in microstructures |
摘要 |
By preparing fully-embedded interconnect structure samples for a cross-section analysis by means of electron microscopy or x-ray microscopy, degradation mechanisms may be efficiently monitored. Moreover, displaying some of the measurement results as a quick motion representation enables the detection of subtle changes of characteristics of an interconnect structure in a highly efficient manner.
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申请公布号 |
US6953755(B2) |
申请公布日期 |
2005.10.11 |
申请号 |
US20030677911 |
申请日期 |
2003.10.02 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
MEYER MORITZ ANDREAS;ZSCHECH EHRENFRIED;LANGER ECKHARD |
分类号 |
G01N23/04;G01N23/223;(IPC1-7):G01R31/28;H01L21/44 |
主分类号 |
G01N23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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