Multilayer circuit board for high frequency signals

摘要

A multilayer circuit board for high-frequency signals includes: a multilayer wiring board unit including, at least one wiring layer, one or more ground layers configured by a conductive material, insulating layers between the layers, and a first external electrode electrically connected to a transmission line on an episurface; and a connector unit including a second external electrode electrically connected to the first external electrode, and a fitting portion for holding on the multilayer wiring board unit an external circuit board or an external connector. The distance d between the first external electrode ( 7 ) and the ground layer perpendicularly below and most closely disposed to the first external electrode is determined within the range d_l<=D<=D_u with respect to the values d_l and d_u defined based on tolerance of the impedance DeltaZ.