发明名称 |
Flexible skin incorporating MEMS technology |
摘要 |
A flexible skin formed of silicon islands encapsulated in a polyimide film. The silicon islands preferably include a MEMS device and are connected together by a polyimide film (preferably about 1-100 mum thick). To create the silicon islands, silicon wafers are etched to a desirable thickness (preferably about 10-500 mum) by Si wet etching and then patterned from the back side by reactive ion etching (RIE). |
申请公布号 |
US6953982(B1) |
申请公布日期 |
2005.10.11 |
申请号 |
US20000567818 |
申请日期 |
2000.05.09 |
申请人 |
CALIFORNIA INSTITUTE OF TECHNOLOGY |
发明人 |
TAI YU-CHONG;JIANG FUKANG;HO CHIHMING |
分类号 |
B81B3/00;B81B7/00;B81C1/00;H01L21/301;(IPC1-7):H01L29/00 |
主分类号 |
B81B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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