Cleaning method of mold for manufacturing semiconductor package and frame for the same,申请号KR20020075836-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	Cleaning method of mold for manufacturing semiconductor package and frame for the same
摘要
申请公布号	KR100520592(B1)	申请公布日期	2005.10.10
申请号	KR20020075836	申请日期	2002.12.02
申请人		发明人
分类号	H01L23/02;(IPC1-7):H01L23/02	主分类号	H01L23/02
代理机构		代理人
主权项
地址

您可能感兴趣的专利

Apparatus for playing a role-playing game

Gaming machine, service providing system, server and mobile device

Hydraulic equipment

Assembly for Purifying Waste Water

Biomimetic process for coating substrates

Non-invasive temperature and composition sensor for partially aqueous targets

Ergonomic chair arm

Packaging system and method

Method and device for transceiver isolation

Air-conditioning

Compositions and methods for angiogenesis-related molecules and treatments

Concrete expansion joint forming device

Component service system

A Container Including Side Wall Retaining Means

Fragrance delivery system

Head assembly for a rotary line trimmer

Pharmaceutical compositions for controlled release delivery of biologically active compounds

Wet shaving assembly

Improved method for simultaneous identification of differentially expressed mRNAs and measurement of relative concentrations