Devices, compositions and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents.
摘要
<p>Incorporating organophilic clay into hot melt adhesive compositions, particularly those comprising semi-crystalline, thermoplastic polymers, greatly improves the adhesive properties in many respects. Some of these improvements are particularly beneficial to the specific use of hot melt adhesives filled with electrically conductive particles for use as electrically conductive adhesives.</p>
